Micro-Precision Compression Spring with Sub-millimeter Precision for Electronics Industry in 316L Stainless Steel and ISO 9001:2015 Certified
Micro-Precision Compression Spring with Sub-millimeter Precision for Electronics Industry in 316L Stainless Steel and ISO 9001:2015 Certified
Basic Properties
Place of Origin:
Sihong, China
Brand Name:
Sunzo
Certification:
CE/IATF16949/45001/14001/9001
Trading Properties
Minimum Order Quantity:
Negotiable
Price:
Negotiable
Payment Terms:
Negotiable
Product Summary
Micro-precision compression springs for electronics. ±0.001mm tolerances, 316L stainless steel or beryllium copper options. ISO 9001 certified with 100% AOI inspection. Ultra-reliable for switches, connectors & medical devices.
Product Custom Attributes
Highlight
micro helical spring
,micro compression spring
,316l helical spring
Wire Diameter:
0.08mm
Dimensional Tolerance:
±0.001mm
Salt Spray Resistance:
1000-hour
Electrical Conductivity:
98%
Operating Temperature Range:
-40°C To 125°C
Coil Pitch Uniformity:
±0.005mm
Free Length Tolerance:
±0.01mm
Surface Defect Detection:
5μm
Cycle Fatigue Testing:
10⁶ Cycles
Load-deflection Accuracy:
±1%
Battery Contact Wire Diameter:
0.1mm
Battery Contact Free Length:
2.5mm
EMI-shielded Resistance:
<10mΩ
Material Type:
316L Stainless Steel, Beryllium Copper Alloys (C17200), Nickel-titanium Shape Memory Alloys
Yield Strength Testing:
80%
Field Failure Rate:
0.003% Ppm
Prototyping Turnaround:
72-hour
Cleanliness Standard:
ISO 16232-11
Biocompatible Coating:
PTFE
Modeling Capability:
Sub-micron
Product Description
Detailed Specifications & Features
Compression Spring for Electronics Industry Micro-Precision Engineering
Designed for reliable precision component operation in demanding electronic applications.
Engineering Excellence
In the electronics industry, compression springs serve as mission-critical components where miniaturization, sub-millimeter precision, and long-term reliability directly impact device performance and user safety. Our Helical Compression Springs are engineered specifically for electronic applications, delivering exceptional performance in micro-switches, PCB connectors, sensor modules, and precision actuators.
Leveraging advanced CAD (SolidWorks 2024) with sub-micron modeling capabilities and FEA (ANSYS Electronics Desktop) simulations, our engineering team achieves dimensional tolerances as tight as ±0.001mm for wire diameters down to 0.08mm—critical for fitting within the compact enclosures of modern smartphones, wearables, and medical devices.
Material Science Innovation
Our electronic springs feature advanced material technologies:
- 316L Stainless Steel: Passivation treatment achieves 1000-hour salt spray resistance (per ASTM B117)
- Beryllium Copper Alloys (C17200): Provide 98% electrical conductivity for signal-carrying contacts
- Nickel-Titanium Shape Memory Alloys: Maintain load stability across -40°C to 125°C operating ranges for high-temperature applications
Each material undergoes ultrasonic cleaning and particulate testing to meet ISO 16232-11 cleanliness standards for electronic components.
Manufacturing Precision
Manufacturing precision is ensured through micro-coiling technology with diamond-tipped tooling, achieving:
- Coil pitch uniformity of ±0.005mm
- Free length tolerance of ±0.01mm
Post-production processes include laser marking for traceability and 100% automated optical inspection (AOI) to detect surface defects as small as 5μm. Dynamic performance testing includes 10⁶ cycle fatigue testing at 80% of yield strength and load-deflection verification with ±1% accuracy using micro-force testing systems.
Application-Specific Solutions
- Ultra-miniature battery contact springs for IoT devices (0.1mm wire diameter, 2.5mm free length)
- EMI-shielded compression springs for 5G communication modules (conductive coating with <10mΩ resistance)
- Medical-grade springs for insulin pumps (biocompatible PTFE coating, ISO 10993-5 compliant)
Quality & Reliability
Backed by ISO 9001:2015 quality management and a dedicated electronics R&D team with 15+ years of micro-component engineering experience, we provide rapid prototyping (72-hour turnaround) and volume production capabilities. Our springs currently power over 500 million electronic devices worldwide, with a field failure rate below 0.003% ppm—testament to our commitment to precision and reliability in the electronics ecosystem.
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